AMD Ryzen 5 7600 vs Intel Core i3-13100F

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Ryzen 5 7600 compared with Core i3-13100F

	AMDRyzen 5 7600	IntelCore i3-13100F
Overview
Released
Released	January 2023	January 2023
Cores and clocks
Cores
Cores	6 (better)	4 (4 performance, 0 efficiency)
Threads
Threads	12 (better)	8
Base clock
Base clock	3.8 GHz	3.4 GHz
Boost clock
Boost clock	5.1 GHz (better)	4.5 GHz
L3 cache
L3 cache	32 MB (better)	12 MB
Cores
Cores	Zen 4; Raphael; 2 package dies; simultaneous multithreading	Four P-cores and no E-cores; Hyper-Threading supported.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; first availability 10 January 2023 in AMD's launch release, although the current product page lists 14 January	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.
Cache
Cache	L1 384 KB; L2 6 MB; L3 32 MB	12 MB Intel Smart Cache (L3); 5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	No integrated graphics; a separate graphics card is required (Intel support).
AI engine
AI engine	–	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	65 W	58 W
Maximum power
Maximum power	–	110 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	–
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	AMD Wraith Stealth; Tjmax 95°C	Boxed retail processor includes Intel Laminar RM1 (Intel support).