AMD Ryzen 5 7600 vs Intel Core i5-11400F

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Ryzen 5 7600 compared with Core i5-11400F

	AMDRyzen 5 7600	IntelCore i5-11400F
Overview
Released
Released	January 2023	March 2021
Cores and clocks
Cores
Cores	6	6
Threads
Threads	12	12
Base clock
Base clock	3.8 GHz	2.6 GHz
Boost clock
Boost clock	5.1 GHz (better)	4.4 GHz
L3 cache
L3 cache	32 MB (better)	12 MB
Cores
Cores	Zen 4; Raphael; 2 package dies; simultaneous multithreading	6 cores and 12 threads; Rocket Lake, Cypress Cove architecture. Multiplier locked (Rock Paper Shotgun). First sale on 30 March 2021 is reported by TechRadar from Intel’s statement; the 16 March press release announced the generation.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; first availability 10 January 2023 in AMD's launch release, although the current product page lists 14 January	2.6 GHz base; up to 4.4 GHz Intel Turbo Boost 2.0.
Cache
Cache	L1 384 KB; L2 6 MB; L3 32 MB	–
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	No integrated graphics; a separate graphics card is required (Intel F-series support).
Platform
Socket
Socket	AM5	LGA1200
Base power
Base power	65 W	65 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 128 GB; two channels; DDR4-3200; 50 GB/s stated by Intel; ECC not supported.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 4.0; 20 CPU lanes: 1×16+1×4, 2×8+1×4 or 1×8+3×4.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	500-series and selected Z490/H470 motherboards with appropriate BIOS support (Rock Paper Shotgun); support is not universal across all 400-series boards.
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	14 nm; 37.5×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	AMD Wraith Stealth; Tjmax 95°C	A fan heatsink is included with the retail box (TechPowerUp exact-model unboxing).