AMD Ryzen 7 2700X vs AMD Ryzen 7 5700X3D

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Ryzen 7 2700X compared with Ryzen 7 5700X3D

	AMDRyzen 7 2700X	AMDRyzen 7 5700X3D
Overview
Released
Released	April 2018	January 2024
Cores and clocks
Cores
Cores	8	8
Threads
Threads	16	16
Base clock
Base clock	3.7 GHz	3 GHz
Boost clock
Boost clock	4.3 GHz (better)	4.1 GHz
L3 cache
L3 cache	16 MB	96 MB (better)
Cores
Cores	Zen+; Pinnacle Ridge; eight cores with simultaneous multithreading.	Zen 3; Vermeer; 2 package dies; simultaneous multithreading
Clocks
Clocks	Precision Boost 2 and Extended Frequency Range 2; unlocked for overclocking.	No direct multiplier-based CPU overclocking, core-voltage adjustment or officially supported PBO (Tom's Hardware). AMD support lists 8 January announcement; maker release states sale from 31 January 2024
Cache
Cache	768 KB L1; 4 MB L2; 16 MB L3.	L1 512 KB; L2 4 MB; L3 96 MB
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required.	No integrated graphics; a separate graphics card is required
Platform
Socket
Socket	AM4	AM4
Base power
Base power	105 W	105 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	DDR4; two channels; up to 2933 MT/s.	DDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667
PCIe
PCIe	PCIe 3.0 x16.	PCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA ports
Chipsets
Chipsets	X470 at launch; earlier 300-series AM4 motherboards supported with a compatible BIOS, as specified in AMD's launch notice.	X570, X470, B550, B450 and A520
Process
Process	12nm FinFET.	TSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm²
Cooler
Cooler	AMD Wraith Prism with RGB lighting supplied in the retail box, confirmed by AMD's original launch notice; maximum operating temperature 85°C.	Not included; Tjmax 90°C