AMD Ryzen 7 5700X3D vs AMD Ryzen 7 5800X3D

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen 7 5700X3D compared with Ryzen 7 5800X3D
AMDRyzen 7 5700X3DAMDRyzen 7 5800X3D
Overview
ReleasedJanuary 2024April 2022
Cores and clocks
Cores88
Threads1616
Base clock3 GHz3.4 GHz
Boost clock4.1 GHz4.5 GHz (better)
L3 cache96 MB96 MB
CoresZen 3; Vermeer; 2 package dies; simultaneous multithreading8 Zen 3 cores with simultaneous multithreading; codename Vermeer; 2 dies in the package
ClocksNo direct multiplier-based CPU overclocking, core-voltage adjustment or officially supported PBO (Tom's Hardware). AMD support lists 8 January announcement; maker release states sale from 31 January 2024–
CacheL1 512 KB; L2 4 MB; L3 96 MBL1 512 KB, L2 4 MB, L3 96 MB
Graphics and AI
Built-in graphicsNoNo
GraphicsNo integrated graphics; a separate graphics card is requiredNone; a graphics card is required
Platform
SocketAM4AM4
Base power105 W105 W
UnlockedNoNo
Cooler in the boxNoNo
Memory supportDDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667DDR4, 2 channels, up to 128 GB (UDIMM); DDR4-3200 with 2 modules, DDR4-2933 (1 rank), DDR4-2667 (2 rank) with 4; ECC with motherboard support
PCIePCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA portsPCIe 4.0; 24 lanes (20 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps)
ChipsetsX570, X470, B550, B450 and A520X570, X470, B550, B450, A520
ProcessTSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm²TSMC 7nm FinFET (CPU cores), 12nm (Globalfoundries) (I/O die)
CoolerNot included; Tjmax 90°CNot included; Liquid cooler recommended for optimal performance; Tjmax 90°C

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