AMD Ryzen 7 7700X vs Intel Core i5-13600K
Better figure, where one is clearly better
| AMDRyzen 7 7700X | IntelCore i5-13600K | |
|---|---|---|
| Overview | ||
| Released | September 2022 | October 2022 |
| Cores and clocks | ||
| Cores | 8 | 14 (6 performance, 8 efficiency) (better) |
| Threads | 16 | 20 (better) |
| Base clock | 4.5 GHz | 3.5 GHz |
| Boost clock | 5.4 GHz (better) | 5.1 GHz |
| L3 cache | 32 MB (better) | 24 MB |
| Cores | Zen 4; Raphael; 2 package dies; simultaneous multithreading | 6 P-cores and 8 E-cores; 20 threads. Intel Thread Director supported. |
| Clocks | Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported | P-cores: 3.5 GHz base, up to 5.1 GHz turbo. E-cores: 2.6 GHz base, up to 3.9 GHz turbo. |
| Cache | L1 512 KB; L2 8 MB; L3 32 MB | 24 MB Intel Smart Cache (L3); 20 MB total L2. |
| Graphics and AI | ||
| Built-in graphics | Yes | Yes |
| Graphics | AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported | Intel UHD Graphics 770; 32 execution units; 300 MHz base, up to 1.5 GHz; Quick Sync Video; up to four displays. |
| Platform | ||
| Socket | AM5 | LGA1700 |
| Base power | 105 W | 125 W |
| Maximum power | – | 181 W |
| Unlocked | Yes | Yes |
| Cooler in the box | No | No |
| Memory support | DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported | Up to 192 GB on the current Intel specification page; two channels; DDR5-5600 or DDR4-3200; 89.6 GB/s; ECC supported with an appropriate platform. |
| PCIe | PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports | PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8. |
| Chipsets | A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850 | Intel 600- and 700-series motherboards; BIOS support required. Intel recommends the latest motherboard BIOS and Intel Default Settings to mitigate 13th/14th-generation Vmin Shift instability risk; 0x12F supplements earlier mitigations (Intel, May 2025). |
| Process | TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm² | Intel 7; Raptor Lake; 45×37.5 mm package; 100°C maximum junction temperature. |
| Cooler | Not included; Tjmax 95°C; AMD recommends a premium air cooler for optimal performance | Boxed K processor does not include a fan heatsink (Intel support). |
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