AMD Ryzen 7 9700X vs Intel Core i7-9800X

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen 7 9700X compared with Core i7-9800X
AMDRyzen 7 9700XIntelCore i7-9800X
Overview
ReleasedAugust 2024November 2018
Cores and clocks
Cores88
Threads1616
Base clock3.8 GHz3.8 GHz
Boost clock5.5 GHz (better)4.5 GHz
L3 cache32 MB (better)16.5 MB
Cores8 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the packageSkylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
ClocksPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer supportedTurbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel’s October announcement states November availability; Kakaku lists November 2018 release for this exact model. The maker-confirmed exact first-sale day remains unverified.
CacheL1 640 KB, L2 8 MB, L3 32 MB16.5 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphicsYesNo
GraphicsAMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt ModeNo processor graphics, explicitly confirmed by Intel’s exact-model support table.
Platform
SocketAM5LGA2066
Base power65 W165 W
UnlockedYesYes
Cooler in the boxNoNo
Memory supportDDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard supportUp to 128 GB; four channels of DDR4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIePCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.044 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
ChipsetsA620, X670E, X670, B650E, B650, X870E, X870, B840, B850Intel X299; LGA2066.
ProcessTSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)14 nm; Skylake-X refresh.
CoolerNot included; Premium air cooler recommended for optimal performance; Tjmax 95°CIntel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 95°C.

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