AMD Ryzen 9 7900X vs AMD Ryzen 9 7950X

Every spec side by side, from each maker's published figures.

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Ryzen 9 7900X compared with Ryzen 9 7950X

	AMDRyzen 9 7900X	AMDRyzen 9 7950X
Overview
Released
Released	September 2022	September 2022
Cores and clocks
Cores
Cores	12	16 (better)
Threads
Threads	24	32 (better)
Base clock
Base clock	4.7 GHz	4.5 GHz
Boost clock
Boost clock	5.6 GHz	5.7 GHz (better)
L3 cache
L3 cache	64 MB	64 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading	16 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 3 dies in the package
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported
Cache
Cache	L1 768 KB; L2 12 MB; L3 64 MB	L1 1024 KB, L2 16 MB, L3 64 MB
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode
Platform
Socket
Socket	AM5	AM5
Base power
Base power	170 W	170 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	DDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard support
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable (generation from AMD launch release; current technical page omits it); 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	TSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)
Cooler
Cooler	Not included; Tjmax 95°C; AMD recommends liquid cooling for optimal performance	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C