AMD Ryzen 9 7900X vs Intel Core i7-13700K

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 9 7900X compared with Core i7-13700K

	AMDRyzen 9 7900X	IntelCore i7-13700K
Overview
Released
Released	September 2022	October 2022
Cores and clocks
Cores
Cores	12	16 (8 performance, 8 efficiency) (better)
Threads
Threads	24	24
Base clock
Base clock	4.7 GHz	3.4 GHz
Boost clock
Boost clock	5.6 GHz (better)	5.4 GHz
L3 cache
L3 cache	64 MB (better)	30 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading	8 P-cores and 8 E-cores; 24 threads. Intel Thread Director supported.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	P-cores: 3.4 GHz base, up to 5.3 GHz Turbo Boost 2.0 and 5.4 GHz Turbo Boost Max 3.0. E-cores: 2.5 GHz base, up to 4.2 GHz turbo.
Cache
Cache	L1 768 KB; L2 12 MB; L3 64 MB	30 MB Intel Smart Cache (L3); 24 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 770; 32 execution units; 300 MHz base, up to 1.6 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	170 W	125 W
Maximum power
Maximum power	–	253 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 192 GB on the current Intel specification page; two channels; DDR5-5600 or DDR4-3200; 89.6 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable (generation from AMD launch release; current technical page omits it); 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	Intel 600- and 700-series motherboards; BIOS support required. Intel recommends the latest motherboard BIOS and Intel Default Settings to mitigate 13th/14th-generation Vmin Shift instability risk; 0x12F supplements earlier mitigations (Intel, May 2025).
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7; Raptor Lake; 45×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Not included; Tjmax 95°C; AMD recommends liquid cooling for optimal performance	Boxed K processor does not include a fan heatsink (Intel support).