AMD Ryzen 9 7950X vs AMD Ryzen Threadripper 3990X

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 9 7950X compared with Ryzen Threadripper 3990X

	AMDRyzen 9 7950X	AMDRyzen Threadripper 3990X
Overview
Released
Released	September 2022	February 2020
Cores and clocks
Cores
Cores	16	64 (better)
Threads
Threads	32	128 (better)
Base clock
Base clock	4.5 GHz	2.9 GHz
Boost clock
Boost clock	5.7 GHz (better)	4.3 GHz
L3 cache
L3 cache	64 MB	256 MB (better)
Cores
Cores	16 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 3 dies in the package	Castle Peak; Zen 2 architecture; boxed product ID 100-100000163WOF. Supports TRX40 motherboards. AMD confirms worldwide on-shelf availability on 7 February 2020, after its 6 January announcement.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Precision Boost 2; maximum boost up to 4.3 GHz; unlocked for overclocking
Cache
Cache	L1 1024 KB, L2 16 MB, L3 64 MB	L1 4096 KB; L2 32 MB; the advertised 288 MB combined cache includes L2 and L3
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	A separate graphics card is required
Platform
Socket
Socket	AM5	sTRX4
Base power
Base power	170 W	280 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	DDR4 UDIMM; four channels; maximum 256 GB. Up to 3200 MT/s with four single-rank or dual-rank DIMMs, or 2933 MT/s with eight single-rank DIMMs. ECC requires motherboard support.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	PCIe 4.0; 64 native lanes, 56 usable, plus 16 usable lanes from TRX40. AMD's launch table lists 88 combined processor/chipset lanes, 72 usable.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	–
Process
Process	TSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	CPU cores: TSMC 7 nm FinFET; I/O die: Globalfoundries 12 nm
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Cooler not included; AMD recommends liquid cooling. Maximum operating temperature 95°C.