AMD Ryzen 9 7950X vs AMD Ryzen Threadripper PRO 7975WX

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Ryzen 9 7950X compared with Ryzen Threadripper PRO 7975WX

	AMDRyzen 9 7950X	AMDRyzen Threadripper PRO 7975WX
Overview
Released
Released	September 2022	November 2023
Cores and clocks
Cores
Cores	16	32 (better)
Threads
Threads	32	64 (better)
Base clock
Base clock	4.5 GHz	4 GHz
Boost clock
Boost clock	5.7 GHz (better)	5.3 GHz
L3 cache
L3 cache	64 MB	128 MB (better)
Cores
Cores	16 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 3 dies in the package	Storm Peak; Zen 4 architecture. Boxed product ID 100-100000453WOF; tray 100-000000453. AMD's support launch date of 19 October 2023 is its announcement. HP's 27 November 2023 QuickSpecs lists this CPU as a factory-configured Z6 G5 A option, supporting November availability; AMD's 21 November retail wording does not name the selected PRO models.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer voltage offsets supported
Cache
Cache	L1 1024 KB, L2 16 MB, L3 64 MB	L1 2048 KB; L2 32 MB; the advertised 160 MB combined cache includes L2 and L3
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	A separate graphics card is required
Platform
Socket
Socket	AM5	sTR5
Base power
Base power	170 W	350 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	DDR5 RDIMM; eight channels; up to 5200 MT/s. ECC enabled by default; AMD EXPO supported. WRX90 supports up to 2 TB; TRX50 reduces this to four channels and up to 1 TB.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	PCIe 5.0; 148 native/platform lanes, 144 usable, including 128 PCIe 5.0 lanes with WRX90. TRX50 limits expansion to 92 total/88 usable lanes, including 48 PCIe 5.0. Four native USB 3.2 Gen 2 ports and four SATA ports; NVMe boot and RAID 0, 1, 10 and 5 supported.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	WRX90, TRX50 and AMD PRO 695; AMD PRO technologies, DASH management and AMD Memory Guard supported. Platform capabilities depend on the motherboard.
Process
Process	TSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. Five package dies; CCD 71 mm², I/O die 388 mm².
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Cooler not included; maximum operating temperature 95°C