AMD Ryzen 9 7950X vs Intel Core i9-10920X

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Ryzen 9 7950X compared with Core i9-10920X

	AMDRyzen 9 7950X	IntelCore i9-10920X
Overview
Released
Released	September 2022	2019
Cores and clocks
Cores
Cores	16 (better)	12
Threads
Threads	32 (better)	24
Base clock
Base clock	4.5 GHz	3.5 GHz
Boost clock
Boost clock	5.7 GHz (better)	4.8 GHz
L3 cache
L3 cache	64 MB (better)	19.25 MB
Cores
Cores	16 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 3 dies in the package	Cascade Lake-X; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model family product brief.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Turbo Boost Max 3.0 up to 4.80 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.60 GHz. Intel targeted November 2019 availability, but first actual sale was not established in the bounded source pass; conservative year precision is retained.
Cache
Cache	L1 1024 KB, L2 16 MB, L3 64 MB	19.25 MB Intel Smart Cache; Intel’s exact-model product-brief table identifies it as L3 cache.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
AI engine
AI engine	–	Intel Deep Learning Boost provides CPU inference instructions; this is not a separate NPU.
Platform
Socket
Socket	AM5	LGA2066
Base power
Base power	170 W	165 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Up to 256 GB; four channels of DDR4-2933; 94 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	48 CPU lanes; PCIe 3.0. The 72-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	Intel X299; LGA2066.
Process
Process	TSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	14 nm; Cascade Lake-X.
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 94°C.