AMD Ryzen 9 7950X vs Intel Core i9-13900K

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Ryzen 9 7950X compared with Core i9-13900K

	AMDRyzen 9 7950X	IntelCore i9-13900K
Overview
Released
Released	September 2022	October 2022
Cores and clocks
Cores
Cores	16	24 (8 performance, 16 efficiency) (better)
Threads
Threads	32	32
Base clock
Base clock	4.5 GHz	3 GHz
Boost clock
Boost clock	5.7 GHz	5.8 GHz (better)
L3 cache
L3 cache	64 MB (better)	36 MB
Cores
Cores	16 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 3 dies in the package	8 P-cores and 16 E-cores; 32 threads. Intel Thread Director supported.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	P-cores: 3.0 GHz base, up to 5.4 GHz Turbo Boost 2.0, 5.7 GHz Turbo Boost Max 3.0 and 5.8 GHz Thermal Velocity Boost. E-cores: 2.2 GHz base, up to 4.3 GHz turbo.
Cache
Cache	L1 1024 KB, L2 16 MB, L3 64 MB	36 MB Intel Smart Cache (L3); 32 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	Intel UHD Graphics 770; 32 execution units; 300 MHz base, up to 1.65 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	170 W	125 W
Maximum power
Maximum power	–	253 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Up to 192 GB on the current Intel specification page; two channels; DDR5-5600 or DDR4-3200; 89.6 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	Intel 600- and 700-series motherboards; BIOS support required. Intel recommends the latest motherboard BIOS and Intel Default Settings to mitigate 13th/14th-generation Vmin Shift instability risk; 0x12F supplements earlier mitigations (Intel, May 2025).
Process
Process	TSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	Intel 7; Raptor Lake; 45×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Boxed K processor does not include a fan heatsink (Intel support).