AMD Ryzen 9 9900X vs AMD Ryzen Threadripper PRO 7945WX

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen 9 9900X compared with Ryzen Threadripper PRO 7945WX
AMDRyzen 9 9900XAMDRyzen Threadripper PRO 7945WX
Overview
ReleasedAugust 2024November 2023
Cores and clocks
Cores1212
Threads2424
Base clock4.4 GHz4.7 GHz
Boost clock5.6 GHz (better)5.3 GHz
L3 cache64 MB64 MB
Cores12 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the packageStorm Peak; Zen 4. Boxed product ID 100-100000887WOF; tray ID 100-000000887. Announced 19 October 2023. HP stated November 2023 availability for the Z6 G5 A; its original 27 November QuickSpecs lists this exact processor as a factory option. Release is kept at OEM month precision; the exact first shipping day is unverified. AMD’s 21 November DIY date covered selected PRO models and is not applied here.
ClocksPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer supportedPrecision Boost 2; maximum boost up to 5.3 GHz. Unlocked for overclocking; OEM system restrictions can differ.
CacheL1 960 KB, L2 12 MB, L3 64 MBL1 768 KB; L2 12 MB; L3 64 MB
Graphics and AI
Built-in graphicsYesNo
GraphicsAMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt ModeA separate graphics card is required
Platform
SocketAM5sTR5
Base power120 W350 W
UnlockedYesYes
Cooler in the boxNoNo
Memory supportDDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard supportDDR5 RDIMM; eight channels; up to 5200 MT/s; ECC enabled by default. WRX90 supports up to 2 TB and eight channels; TRX50 with a PRO processor supports up to 1 TB and four channels.
PCIePCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0PCIe 5.0; native total/usable/Gen5 lanes: 148/144/128. AMD lists 128 Gen5 lanes on WRX90, or 48 on TRX50. Four native USB 3.2 Gen 2 ports and four SATA ports.
ChipsetsA620, X670E, X670, B650E, B650, X870E, X870, B840, B850WRX90 and TRX50; motherboard and OEM system configuration determines available memory channels, I/O and overclocking support
ProcessTSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. CCD 71 mm²; I/O die 388 mm²; three package dies.
CoolerNot included; Liquid cooler recommended for optimal performance; Tjmax 95°CCooler not included. Maximum operating temperature 95°C.

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