AMD Ryzen 9 9950X vs AMD Ryzen Threadripper PRO 7985WX

Every spec side by side, from each maker's published figures.

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Ryzen 9 9950X compared with Ryzen Threadripper PRO 7985WX
AMDRyzen 9 9950XAMDRyzen Threadripper PRO 7985WX
Overview
ReleasedAugust 2024November 2023
Cores and clocks
Cores1664 (better)
Threads32128 (better)
Base clock4.3 GHz3.2 GHz
Boost clock5.7 GHz (better)5.1 GHz
L3 cache64 MB256 MB (better)
Cores16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the packageStorm Peak; Zen 4 architecture. Boxed 100-100000454WOF; tray 100-000000454. AMD’s 19 October 2023 support launch date is the announcement. HP’s 27 November 2023 QuickSpecs lists this exact CPU as a factory-configured Z6 G5 A option, supporting November availability; AMD’s 21 November retail wording does not name the selected PRO models.
ClocksPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer supportedPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer voltage offsets supported
CacheL1 1280 KB, L2 16 MB, L3 64 MBL1 4096 KB; L2 64 MB
Graphics and AI
Built-in graphicsYesNo
GraphicsAMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt ModeA separate graphics card is required
Platform
SocketAM5sTR5
Base power170 W350 W
UnlockedYesYes
Cooler in the boxNoNo
Memory supportDDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard supportDDR5 RDIMM; eight channels; up to 5200 MT/s. ECC enabled by default; AMD EXPO supported. WRX90 supports up to 2 TB; TRX50 reduces this to four channels and up to 1 TB.
PCIePCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0PCIe 5.0; 148 native/platform lanes, 144 usable, including 128 PCIe 5.0 lanes with WRX90. TRX50 limits expansion to 92 total/88 usable lanes, including 48 PCIe 5.0. Four native USB 3.2 Gen 2 ports and four SATA ports; NVMe boot and RAID 0, 1, 5 and 10 supported.
ChipsetsA620, X670E, X670, B650E, B650, X870E, X870, B840, B850WRX90, TRX50 and AMD PRO 695; AMD PRO technologies, DASH management and AMD Memory Guard supported. Platform capabilities depend on the motherboard.
ProcessTSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. 9 package dies; CCD 71 mm², I/O die 388 mm².
CoolerNot included; Liquid cooler recommended for optimal performance; Tjmax 95°CCooler not included; maximum operating temperature 95°C

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