AMD Ryzen Threadripper 2920X vs Intel Core i9-10920X

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen Threadripper 2920X compared with Core i9-10920X
AMDRyzen Threadripper 2920XIntelCore i9-10920X
Overview
ReleasedOctober 20182019
Cores and clocks
Cores1212
Threads2424
Base clock3.5 GHz3.5 GHz
Boost clock4.3 GHz4.8 GHz (better)
L3 cache32 MB (better)19.25 MB
CoresColfax; Zen+ architecture; boxed product ID YD292XA8AFWOF. X399 motherboards may require a BIOS update. AMD's October launch release confirms availability on 29 October 2018; its support page gives October 2018.Cascade Lake-X; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model family product brief.
ClocksPrecision Boost 2, XFR2 and Precision Boost Overdrive supportedTurbo Boost Max 3.0 up to 4.80 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.60 GHz. Intel targeted November 2019 availability, but first actual sale was not established in the bounded source pass; conservative year precision is retained.
CacheL1 1152 KB; L2 6 MB19.25 MB Intel Smart Cache; Intel’s exact-model product-brief table identifies it as L3 cache.
Graphics and AI
Built-in graphicsNoNo
GraphicsA separate graphics card is requiredNo processor graphics, explicitly confirmed by Intel’s exact-model support table.
AI engine–Intel Deep Learning Boost provides CPU inference instructions; this is not a separate NPU.
Platform
SocketsTR4LGA2066
Base power180 W165 W
UnlockedYesYes
Cooler in the boxNoNo
Memory supportDDR4; four channels; up to 2933 MT/sUp to 256 GB; four channels of DDR4-2933; 94 GB/s maximum published bandwidth; no ECC.
PCIePCIe 3.0; 64 processor lanes, 72 lanes across the processor and X399 platform48 CPU lanes; PCIe 3.0. The 72-lane family platform figure includes chipset lanes.
Chipsets–Intel X299; LGA2066.
Process12 nm14 nm; Cascade Lake-X.
CoolerNo cooler included; maximum operating temperature 68°CIntel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 94°C.

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