AMD Ryzen Threadripper 3970X vs AMD Ryzen Threadripper 7970X

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Ryzen Threadripper 3970X compared with Ryzen Threadripper 7970X

	AMDRyzen Threadripper 3970X	AMDRyzen Threadripper 7970X
Overview
Released
Released	November 2019	November 2023
Cores and clocks
Cores
Cores	32	32
Threads
Threads	64	64
Base clock
Base clock	3.7 GHz	4 GHz
Boost clock
Boost clock	4.5 GHz	5.3 GHz (better)
L3 cache
L3 cache	128 MB	128 MB
Cores
Cores	Castle Peak; Zen 2 architecture; boxed product ID 100-100000011WOF. Requires sTRX4/TRX40, incompatible with sTR4/X399 motherboards. AMD confirms worldwide first availability on 25 November 2019, after its 7 November announcement.	Storm Peak; Zen 4 architecture. Boxed product ID 100-100001351WOF; tray 100-000001351. AMD's support page gives 19 October 2023 as launch, its announcement date; the launch release confirms retail availability on 21 November.
Clocks
Clocks	Maximum boost up to 4.5 GHz; unlocked for overclocking	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer voltage offsets supported
Cache
Cache	L1 2048 KB; L2 16 MB; the advertised 144 MB combined cache includes L2 and L3	L1 2048 KB; L2 32 MB; the advertised 160 MB combined cache includes L2 and L3
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	A separate graphics card is required	A separate graphics card is required
Platform
Socket
Socket	sTRX4	sTR5
Base power
Base power	280 W	350 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR4; four channels; up to 3200 MT/s	DDR5 RDIMM; four channels; up to 5200 MT/s. ECC enabled by default; AMD EXPO supported. AMD's TRX50 platform table specifies up to 1 TB memory.
PCIe
PCIe	PCIe 4.0; AMD publishes 88 lanes across the processor and TRX40 chipset, with 72 usable	PCIe 5.0; 92 native/platform lanes, 88 usable. AMD's launch platform table distinguishes up to 48 PCIe 5.0 lanes. Four native USB 3.2 Gen 2 ports and two SATA ports; NVMe boot and RAID 0, 1, 10 and 5 supported.
Chipsets
Chipsets	–	TRX50
Process
Process	CPU cores: TSMC 7 nm FinFET	CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. Five package dies; CCD 71 mm², I/O die 388 mm².
Cooler
Cooler	No cooler included; maximum operating temperature 95°C	Cooler not included; maximum operating temperature 95°C