Intel Core i7-14700K vs Intel Core i9-9940X

Every spec side by side, from each maker's published figures.

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Core i7-14700K compared with Core i9-9940X
IntelCore i7-14700KIntelCore i9-9940X
Overview
ReleasedOctober 20232018
Cores and clocks
Cores20 (8 performance, 12 efficiency) (better)14
Threads2828
Base clock3.4 GHz3.3 GHz
Boost clock5.6 GHz (better)4.5 GHz
L3 cache33 MB (better)19.25 MB
Cores8 Performance-cores and 12 Efficient-cores, with Hyper-Threading; codename Raptor LakeSkylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
ClocksP-core base 3.4 GHz, max turbo 5.5 GHz; E-core base 2.5 GHz, max turbo 4.3 GHz; Turbo Boost Max 3.0 5.6 GHzTurbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel planned November 2018 availability. ASCII’s contemporary report confirms Japanese retail sale on 21 December 2018, but earlier worldwide sale was not established; year precision is retained.
Cache33 MB Intel Smart Cache (L3); 28 MB L219.25 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphicsYesNo
GraphicsIntel UHD Graphics 770, 32 execution units, up to 1.6 GHz; outputs eDP 1.4b, DP 1.4a, HDMI 2.1; up to 4 displaysNo processor graphics, explicitly confirmed by Intel’s exact-model support table.
Platform
SocketLGA1700LGA2066
Base power125 W165 W
Maximum power253 W–
UnlockedYesYes
Cooler in the box–No
Memory supportUp to DDR5 5600 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GB; ECC supportedUp to 128 GB; four channels of DDR 4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIePCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x844 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
ChipsetsIntel 600 and 700 seriesIntel X 299; LGA 2066.
ProcessIntel 714 nm; Skylake-X refresh.
Coolermax operating temperature 100 °C; thermal specification PCG 2020AIntel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 88°C.

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