Intel Core i7-6700K vs Intel Core i7-6800K

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Core i7-6700K compared with Core i7-6800K

	IntelCore i7-6700K	IntelCore i7-6800K
Overview
Released
Released	August 2015	May 2016
Cores and clocks
Cores
Cores	4	6 (better)
Threads
Threads	8	12 (better)
Base clock
Base clock	4 GHz	3.4 GHz
Boost clock
Boost clock	4.2 GHz (better)	3.8 GHz
L3 cache
L3 cache	8 MB	15 MB (better)
Cores
Cores	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.	Broadwell-E; 6 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews.
Clocks
Clocks	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.	Turbo Boost Max 3.0 up to 3.80 GHz on the preferred core; ordinary Turbo Boost 2.0 up to 3.60 GHz. The main boost field uses Intel’s highest published frequency. May availability follows Tom’s Hardware’s 31 May 2016 report, attributing immediate sale of all four models to Intel. Intel’s family record is dated 30 May and ARK gives Q2 2016; the announcement day is not treated as an exact first-sale day.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	Intel HD Graphics 530; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. DisplayPort and eDP up to 4096×2304 at 60 Hz; HDMI up to 4096×2304 at 24 Hz.	No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required.
Platform
Socket
Socket	LGA1151	LGA2011-v3
Base power
Base power	91 W	140 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 64 GB; two channels; DDR4-1866/2133 or DDR3L-1333/1600 at 1.35 V; 34.1 GB/s maximum bandwidth; ECC not supported.	Up to 128 GB; four channels of DDR4-2133/2400; no ECC.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. PC Gamer describes the Z170 platform's faster DMI 3.0 chipset link and expanded storage connectivity.	28 CPU lanes; PCIe 3.0
Chipsets
Chipsets	–	X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform.
Process
Process	14 nm; Skylake; 37.5 × 37.5 mm package; Intel lists a 64°C Tcase limit, which is a case-temperature specification rather than a junction-temperature limit.	14 nm; Broadwell-E.
Cooler
Cooler	Boxed processor includes no fan or heatsink. Requires a compatible Intel 100-series motherboard; the launch notice names the Z170 chipset for unlocked processors.	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required.