AMD Ryzen 3 3200G vs AMD Ryzen 5 8500G

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Ryzen 3 3200G compared with Ryzen 5 8500G

	AMDRyzen 3 3200G	AMDRyzen 5 8500G
Overview
Released
Released	July 2019	January 2024
Cores and clocks
Cores
Cores	4	6 (better)
Threads
Threads	4	12 (better)
Base clock
Base clock	3.6 GHz	3.5 GHz
Boost clock
Boost clock	4 GHz	5 GHz (better)
L3 cache
L3 cache	4 MB	16 MB (better)
Cores
Cores	Picasso; Zen+ architecture, rather than the Zen 2 architecture of Ryzen 3000 processors without integrated graphics (Tech Buyer's Guru).	Two Zen 4 and four Zen 4c cores; both support simultaneous multithreading. AMD names the family Phoenix; TechPowerUp identifies the smaller monolithic Phoenix 2 die.
Clocks
Clocks	–	AMD lists 3.5 GHz overall base; Zen 4 base 4.1 GHz, boost up to 5 GHz; Zen 4c base 3.3 GHz, boost up to 3.7 GHz. CPU multiplier locked in TechPowerUp testing; Precision Boost Overdrive, Curve Optimizer and EXPO supported. Configurable TDP 45–65 W.
Cache
Cache	384 KB L1; 2 MB L2.	6 MB L2; 16 MB shared L3.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Radeon Vega 8 Graphics; eight graphics cores; 1250 MHz.	Radeon 740M; RDNA 3; four graphics cores at 2800 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.
AI engine
AI engine	–	No dedicated Ryzen AI NPU (TechPowerUp and Phoronix).
Platform
Socket
Socket	AM4	AM5
Base power
Base power	65 W	65 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	DDR4; two channels; up to 2933 MT/s.	DDR5 UDIMM; two channels; AMD lists maximum DDR5 capacity of 96 GB; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.
PCIe
PCIe	PCIe 3.0 x8, as listed by AMD.	PCIe 4.0; 14 native lanes, 10 usable; graphics slot limited to ×4 (TechPowerUp). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.
Chipsets
Chipsets	–	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.
Process
Process	12nm FinFET.	TSMC 4nm FinFET; 137 mm² CPU compute die; one package die.
Cooler
Cooler	Wraith Stealth included with boxed and multipack processors; configurable TDP 45–65 W; maximum operating temperature 95°C.	95°C maximum operating temperature. Retail review package includes an air cooler (TechPowerUp); check the exact retail or tray bundle.