AMD Ryzen 5 5600 vs AMD Ryzen 5 8500G

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen 5 5600 compared with Ryzen 5 8500G
AMDRyzen 5 5600AMDRyzen 5 8500G
Overview
ReleasedApril 2022January 2024
Cores and clocks
Cores66
Threads1212
Base clock3.5 GHz3.5 GHz
Boost clock4.4 GHz5 GHz (better)
L3 cache32 MB (better)16 MB
CoresZen 3; Vermeer; 2 package dies; simultaneous multithreadingTwo Zen 4 and four Zen 4c cores; both support simultaneous multithreading. AMD names the family Phoenix; TechPowerUp identifies the smaller monolithic Phoenix 2 die.
ClocksPrecision Boost 2; unlocked for overclockingAMD lists 3.5 GHz overall base; Zen 4 base 4.1 GHz, boost up to 5 GHz; Zen 4c base 3.3 GHz, boost up to 3.7 GHz. CPU multiplier locked in TechPowerUp testing; Precision Boost Overdrive, Curve Optimizer and EXPO supported. Configurable TDP 45–65 W.
CacheL1 384 KB; L2 3 MB; L3 32 MB6 MB L2; 16 MB shared L3.
Graphics and AI
Built-in graphicsNoYes
GraphicsNo integrated graphics; a separate graphics card is requiredRadeon 740M; RDNA 3; four graphics cores at 2800 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.
AI engine–No dedicated Ryzen AI NPU (TechPowerUp and Phoronix).
Platform
SocketAM4AM5
Base power65 W65 W
UnlockedYesNo
Cooler in the boxYes–
Memory supportDDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667DDR5 UDIMM; two channels; AMD lists maximum DDR5 capacity of 96 GB; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.
PCIePCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA portsPCIe 4.0; 14 native lanes, 10 usable; graphics slot limited to ×4 (TechPowerUp). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.
ChipsetsX570, X470, X370, B550, B450, B350 and A520AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.
ProcessTSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm²TSMC 4nm FinFET; 137 mm² CPU compute die; one package die.
CoolerAMD Wraith Stealth; Tjmax 90°C95°C maximum operating temperature. Retail review package includes an air cooler (TechPowerUp); check the exact retail or tray bundle.

More comparisons