AMD Ryzen 5 5600 vs Intel Core i7-6800K
Better figure, where one is clearly better
| AMDRyzen 5 5600 | IntelCore i7-6800K | |
|---|---|---|
| Overview | ||
| Released | April 2022 | May 2016 |
| Cores and clocks | ||
| Cores | 6 | 6 |
| Threads | 12 | 12 |
| Base clock | 3.5 GHz | 3.4 GHz |
| Boost clock | 4.4 GHz (better) | 3.8 GHz |
| L3 cache | 32 MB (better) | 15 MB |
| Cores | Zen 3; Vermeer; 2 package dies; simultaneous multithreading | Broadwell-E; 6 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews. |
| Clocks | Precision Boost 2; unlocked for overclocking | Turbo Boost Max 3.0 up to 3.80 GHz on the preferred core; ordinary Turbo Boost 2.0 up to 3.60 GHz. The main boost field uses Intel’s highest published frequency. May availability follows Tom’s Hardware’s 31 May 2016 report, attributing immediate sale of all four models to Intel. Intel’s family record is dated 30 May and ARK gives Q2 2016; the announcement day is not treated as an exact first-sale day. |
| Cache | L1 384 KB; L2 3 MB; L3 32 MB | – |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics; a separate graphics card is required | No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required. |
| Platform | ||
| Socket | AM4 | LGA2011-v3 |
| Base power | 65 W | 140 W |
| Unlocked | Yes | Yes |
| Cooler in the box | Yes | No |
| Memory support | DDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667 | Up to 128 GB; four channels of DDR4-2133/2400; no ECC. |
| PCIe | PCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA ports | 28 CPU lanes; PCIe 3.0 |
| Chipsets | X570, X470, X370, B550, B450, B350 and A520 | X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform. |
| Process | TSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm² | 14 nm; Broadwell-E. |
| Cooler | AMD Wraith Stealth; Tjmax 90°C | Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required. |
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