AMD Ryzen 5 9600X vs AMD Ryzen 9 7900X3D

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Ryzen 5 9600X compared with Ryzen 9 7900X3D

	AMDRyzen 5 9600X	AMDRyzen 9 7900X3D
Overview
Released
Released	August 2024	February 2023
Cores and clocks
Cores
Cores	6	12 (better)
Threads
Threads	12	24 (better)
Base clock
Base clock	3.9 GHz	4.4 GHz
Boost clock
Boost clock	5.4 GHz	5.6 GHz (better)
L3 cache
L3 cache	32 MB	128 MB (better)
Cores
Cores	6 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the package	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 6 active cores each, one with 3D V-Cache (Tom's Hardware)
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Direct CPU frequency overclocking is disabled; Precision Boost Overdrive, Curve Optimizer and memory tuning are supported (Tom's Hardware). AMD product launch date 28 February 2023 is corroborated as retail release by TechRadar
Cache
Cache	L1 480 KB, L2 6 MB, L3 32 MB	L1 768 KB; L2 12 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (Tom's Hardware)
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported
Platform
Socket
Socket	AM5	AM5
Base power
Base power	65 W	120 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²
Cooler
Cooler	Not included; Premium air cooler recommended for optimal performance; Tjmax 95°C	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance