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AMD Ryzen 7 5700X vs Intel Core i7-11700K

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

AMDRyzen 7 5700XIntelCore i7-11700K
Overview
ReleasedApril 2022March 2021
Cores and clocks
Cores88
Threads1616
Base clock3.4 GHz3.6 GHz
Boost clock4.6 GHz5 GHz
L3 cache32 MB16 MB
CoresZen 3; Vermeer; 2 package dies; simultaneous multithreadingHyper-Threading, Turbo Boost Max 3.0, AVX-512 and Deep Learning Boost supported. Thermal Velocity Boost is not supported. General retail sale began 30 March 2021, according to Intel's sales-embargo statement reported by Windows Central; the 16 March maker press release was the announcement.
ClocksPrecision Boost 2; unlocked for overclockingUp to 5 GHz with Turbo Boost Max 3.0, or 4.9 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.1 GHz base clock. Tom's Hardware reports 251 W PL2; the current Intel specification page publishes TDP only.
CacheL1 512 KB; L2 4 MB; L3 32 MB–
Graphics and AI
Built-in graphicsNoYes
GraphicsNo integrated graphics; a separate graphics card is requiredIntel UHD Graphics 750; 32 execution units; 350 MHz base, up to 1.3 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 60 Hz; DisplayPort up to 5120×3200 at 60 Hz; Quick Sync Video supported.
AI engine–Intel Gaussian & Neural Accelerator 2.0; Deep Learning Boost on the CPU.
Platform
SocketAM4LGA1200
Base power65 W125 W
UnlockedYesYes
Cooler in the boxNoNo
Memory supportDDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667Up to 128 GB; two channels; DDR4-3200; 50 GB/s maximum bandwidth; ECC not supported. Tom's Hardware reports official Gear 1 support to DDR4-2933, with DDR4-3200 using Gear 2; its review tests faster Gear 1 settings as memory overclocking.
PCIePCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA portsPCIe 4.0; 20 CPU lanes, configured as 1×16+1×4, 2×8+1×4 or 1×8+3×4.
ChipsetsX570, X470, X370, B550, B450, B350 and A520–
ProcessTSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm²14 nm; Rocket Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Cypress Cove CPU architecture (Intel launch announcement).
CoolerNot included; Tjmax 90°CNo cooler included with the boxed processor (Tom's Hardware exact-model review). The photograph shows its labelled preproduction review sample installed in a motherboard.

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