AMD Ryzen 7 7700X vs Intel Core i7-11700K

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Ryzen 7 7700X compared with Core i7-11700K

	AMDRyzen 7 7700X	IntelCore i7-11700K
Overview
Released
Released	September 2022	March 2021
Cores and clocks
Cores
Cores	8	8
Threads
Threads	16	16
Base clock
Base clock	4.5 GHz	3.6 GHz
Boost clock
Boost clock	5.4 GHz (better)	5 GHz
L3 cache
L3 cache	32 MB (better)	16 MB
Cores
Cores	Zen 4; Raphael; 2 package dies; simultaneous multithreading	Hyper-Threading, Turbo Boost Max 3.0, AVX-512 and Deep Learning Boost supported. Thermal Velocity Boost is not supported. General retail sale began 30 March 2021, according to Intel's sales-embargo statement reported by Windows Central; the 16 March maker press release was the announcement.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Up to 5 GHz with Turbo Boost Max 3.0, or 4.9 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.1 GHz base clock. Tom's Hardware reports 251 W PL2; the current Intel specification page publishes TDP only.
Cache
Cache	L1 512 KB; L2 8 MB; L3 32 MB	–
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 750; 32 execution units; 350 MHz base, up to 1.3 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 60 Hz; DisplayPort up to 5120×3200 at 60 Hz; Quick Sync Video supported.
AI engine
AI engine	–	Intel Gaussian & Neural Accelerator 2.0; Deep Learning Boost on the CPU.
Platform
Socket
Socket	AM5	LGA1200
Base power
Base power	105 W	125 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 128 GB; two channels; DDR4-3200; 50 GB/s maximum bandwidth; ECC not supported. Tom's Hardware reports official Gear 1 support to DDR4-2933, with DDR4-3200 using Gear 2; its review tests faster Gear 1 settings as memory overclocking.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 4.0; 20 CPU lanes, configured as 1×16+1×4, 2×8+1×4 or 1×8+3×4.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	–
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	14 nm; Rocket Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Cypress Cove CPU architecture (Intel launch announcement).
Cooler
Cooler	Not included; Tjmax 95°C; AMD recommends a premium air cooler for optimal performance	No cooler included with the boxed processor (Tom's Hardware exact-model review). The photograph shows its labelled preproduction review sample installed in a motherboard.