AMD Ryzen 7 7800X3D vs Intel Core i9-11900K

Every spec side by side, from each maker's published figures.

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Ryzen 7 7800X3D compared with Core i9-11900K
AMDRyzen 7 7800X3DIntelCore i9-11900K
Overview
ReleasedApril 2023March 2021
Cores and clocks
Cores88
Threads1616
Base clock4.2 GHz3.5 GHz
Boost clock5 GHz5.3 GHz (better)
L3 cache96 MB (better)16 MB
Cores8 Zen 4 cores with simultaneous multithreading; codename Raphael AM5; 2 dies in the packageHyper-Threading, Turbo Boost Max 3.0, Thermal Velocity Boost, AVX-512 and Deep Learning Boost supported. General retail sale began 30 March 2021, according to Intel's sales-embargo statement reported by Windows Central; the 16 March maker press release was the announcement.
ClocksPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer supportedUp to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3 GHz base clock. Adaptive Boost Technology raises all-core clocks when power and thermal conditions allow (PC Gamer). Tom's Hardware reports 250 W PL2; the current Intel specification page publishes TDP only.
CacheL1 512 KB, L2 8 MB, L3 96 MB–
Graphics and AI
Built-in graphicsYesYes
GraphicsAMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt ModeIntel UHD Graphics 750; 32 execution units; 350 MHz base, up to 1.3 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 60 Hz; DisplayPort up to 5120×3200 at 60 Hz; Quick Sync Video supported.
AI engine–Intel Gaussian & Neural Accelerator 2.0; Deep Learning Boost on the CPU.
Platform
SocketAM5LGA1200
Base power120 W125 W
UnlockedNoYes
Cooler in the boxNoNo
Memory supportDDR5, 2 channels, up to 128 GB (UDIMM); DDR5-5200 with 2 modules, DDR5-3600 with 4; ECC with motherboard supportUp to 128 GB; two channels; DDR4-3200; 50 GB/s maximum bandwidth; ECC not supported. Tom's Hardware identifies DDR4-3200 Gear 1 as officially supported on the Core i9 models.
PCIePCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0PCIe 4.0; 20 CPU lanes, configured as 1×16+1×4, 2×8+1×4 or 1×8+3×4.
ChipsetsA620, X670E, X670, B650E, B650, X870E, X870, B840, B850–
ProcessTSMC 5nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)14 nm; Rocket Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Cypress Cove CPU architecture (Intel launch announcement).
CoolerNot included; Liquid cooler recommended for optimal performance; Tjmax 89°CNo cooler included with the boxed processor (Tom's Hardware exact-model review).

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