AMD Ryzen 7 8700G vs AMD Ryzen 9 9950X3D2 Dual Edition

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 7 8700G compared with Ryzen 9 9950X3D2 Dual Edition

	AMDRyzen 7 8700G	AMDRyzen 9 9950X3D2 Dual Edition
Overview
Released
Released	January 2024	April 2026
Cores and clocks
Cores
Cores	8	16 (better)
Threads
Threads	16	32 (better)
Base clock
Base clock	4.2 GHz	4.3 GHz
Boost clock
Boost clock	5.1 GHz	5.6 GHz (better)
L3 cache
L3 cache	16 MB	192 MB (better)
Cores
Cores	Zen 4; Phoenix; simultaneous multithreading; one monolithic package die.	16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the package
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; configurable TDP 45–65 W.	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported
Cache
Cache	8 MB L2; 16 MB L3.	L1 1280 KB, L2 16 MB, L3 192 MB
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Radeon 780M; RDNA 3; 12 graphics cores at 2900 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode
AI engine
AI engine	AMD Ryzen AI; XDNA neural processing unit; up to 16 TOPS.	–
Platform
Socket
Socket	AM5	AM5
Base power
Base power	65 W	200 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	–	No
Memory support
Memory support	DDR5 UDIMM; two channels; up to 256 GB on the current AMD specification page; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support
PCIe
PCIe	PCIe 4.0; 20 native lanes, 16 usable; discrete graphics slot up to ×8 (PC Gamer and TechSpot). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0
Chipsets
Chipsets	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850
Process
Process	TSMC 4nm FinFET; 178 mm² CPU compute die.	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)
Cooler
Cooler	95°C maximum operating temperature. Launch review boxes included a Wraith Spire (PC Gamer); current AMD IDs include SBX and CSX, and the maker notes revised cooler bundles for selected MPK models from August 2025. Verify the exact retail bundle.	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C