AMD Ryzen 7 9700X vs Intel Core 2 Duo E6600
Better figure, where one is clearly better
| AMDRyzen 7 9700X | IntelCore 2 Duo E6600 | |
|---|---|---|
| Overview | ||
| Released | August 2024 | July 2006 |
| Cores and clocks | ||
| Cores | 8 (better) | 2 |
| Threads | 16 (better) | 2 |
| Base clock | 3.8 GHz | 2.4 GHz |
| Boost clock | 5.5 GHz | – |
| L3 cache | 32 MB | – |
| Cores | 8 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the package | Conroe; two cores and two threads, without Hyper-Threading. |
| Clocks | Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported | Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied. |
| Cache | L1 640 KB, L2 8 MB, L3 32 MB | 4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied. |
| Graphics and AI | ||
| Built-in graphics | Yes | No |
| Graphics | AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode | No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor. |
| Platform | ||
| Socket | AM5 | LGA775 |
| Base power | 65 W | 65 W |
| Unlocked | Yes | – |
| Cooler in the box | No | Yes |
| Memory support | DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support | Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard. |
| PCIe | PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0 | – |
| Chipsets | A620, X670E, X670, B650E, B650, X870E, X870, B840, B850 | – |
| Process | TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die) | 65 nm; Conroe; LGA775. |
| Cooler | Not included; Premium air cooler recommended for optimal performance; Tjmax 95°C | Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W. |
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