AMD Ryzen 7 9700X vs Intel Core 2 Duo E6600

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Ryzen 7 9700X compared with Core 2 Duo E6600
AMDRyzen 7 9700XIntelCore 2 Duo E6600
Overview
ReleasedAugust 2024July 2006
Cores and clocks
Cores8 (better)2
Threads16 (better)2
Base clock3.8 GHz2.4 GHz
Boost clock5.5 GHz–
L3 cache32 MB–
Cores8 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the packageConroe; two cores and two threads, without Hyper-Threading.
ClocksPrecision Boost 2; Precision Boost Overdrive and Curve Optimizer supportedPublished operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.
CacheL1 640 KB, L2 8 MB, L3 32 MB4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.
Graphics and AI
Built-in graphicsYesNo
GraphicsAMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt ModeNo integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.
Platform
SocketAM5LGA775
Base power65 W65 W
UnlockedYes–
Cooler in the boxNoYes
Memory supportDDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard supportIntel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.
PCIePCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0–
ChipsetsA620, X670E, X670, B650E, B650, X870E, X870, B840, B850–
ProcessTSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)65 nm; Conroe; LGA775.
CoolerNot included; Premium air cooler recommended for optimal performance; Tjmax 95°CIntel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.

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