AMD Ryzen 7 9700X vs Intel Core 2 Duo E8400

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 7 9700X compared with Core 2 Duo E8400

	AMDRyzen 7 9700X	IntelCore 2 Duo E8400
Overview
Released
Released	August 2024	January 2008
Cores and clocks
Cores
Cores	8 (better)	2
Threads
Threads	16 (better)	2
Base clock
Base clock	3.8 GHz	3 GHz
Boost clock
Boost clock	5.5 GHz	–
L3 cache
L3 cache	32 MB	–
Cores
Cores	8 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the package	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.
Cache
Cache	L1 640 KB, L2 8 MB, L3 32 MB	6 MB shared L2 cache; no L3 figure supplied.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.
Platform
Socket
Socket	AM5	LGA775
Base power
Base power	65 W	65 W
Unlocked
Unlocked	Yes	–
Cooler in the box
Cooler in the box	No	Yes
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	–
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	–
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	45 nm; Wolfdale; LGA775; SSE4.1 support.
Cooler
Cooler	Not included; Premium air cooler recommended for optimal performance; Tjmax 95°C	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.