AMD Ryzen 7 9700X vs Intel Core 2 Quad Q6600

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Ryzen 7 9700X compared with Core 2 Quad Q6600

	AMDRyzen 7 9700X	IntelCore 2 Quad Q6600
Overview
Released
Released	August 2024	January 2007
Cores and clocks
Cores
Cores	8 (better)	4
Threads
Threads	16 (better)	4
Base clock
Base clock	3.8 GHz	2.4 GHz
Boost clock
Boost clock	5.5 GHz	–
L3 cache
L3 cache	32 MB	–
Cores
Cores	8 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 2 dies in the package	Kentsfield; four cores and four threads, without Hyper-Threading. Original B3 stepping is the numerical baseline; later G0 retains the model name and core/cache figures. Locked multiplier confirmed by bit-tech’s exact-model review.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel’s 8 January 2007 release explicitly states immediate availability in PCs and the reseller channel. No unpublished boost frequency is supplied.
Cache
Cache	L1 640 KB, L2 8 MB, L3 32 MB	Two 4 MB L2 caches, one per dual-core die; total 8 MB. Intel’s datasheet also lists four 32 KB L1 data caches. No L3 figure is supplied.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No integrated graphics, confirmed by the exact BX80562Q6600 retail listing; motherboard graphics are a separate component.
Platform
Socket
Socket	AM5	LGA775
Base power
Base power	65 W	105 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	No	Yes
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; memory types and capacity depend on the motherboard.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	–
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	–
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	65 nm; Kentsfield; LGA775.
Cooler
Cooler	Not included; Premium air cooler recommended for optimal performance; Tjmax 95°C	Boxed BX80562Q6600 listing confirms heatsink and fan. Intel’s datasheet and PCN107463 distinguish original B3 105 W from later G0 95 W; the projected July 2007 conversion date is not treated as an independently verified sale day.