AMD Ryzen 9 3900X vs Intel Core i7-5960X

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Ryzen 9 3900X compared with Core i7-5960X

	AMDRyzen 9 3900X	IntelCore i7-5960X
Overview
Released
Released	July 2019	August 2014
Cores and clocks
Cores
Cores	12 (better)	8
Threads
Threads	24 (better)	16
Base clock
Base clock	3.8 GHz	3 GHz
Boost clock
Boost clock	4.6 GHz (better)	3.5 GHz
L3 cache
L3 cache	64 MB (better)	20 MB
Cores
Cores	Zen 2; Matisse; twelve cores with simultaneous multithreading. Two CPU chiplets with six active cores each and a separate I/O die (PCGamesN).	Haswell-E; 8 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews.
Clocks
Clocks	Unlocked for overclocking; Precision Boost Overdrive with Automatic Overclocking supported, as described in AMD's launch notice.	Turbo Boost 2.0 up to 3.50 GHz. August release month follows PCWorld’s 29 August report that Intel was shipping the models and TechSpot’s same-day expected retail availability. Intel’s 29 August notice instead says the three SKUs will be available next week; an exact maker first-sale day is unresolved.
Cache
Cache	768 KB L1; 6 MB L2; 64 MB L3.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required.	No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required.
Platform
Socket
Socket	AM4	LGA2011-v3
Base power
Base power	105 W	140 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	DDR4; two channels; up to 3200 MT/s.	Up to 64 GB; four channels of DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC.
PCIe
PCIe	PCIe 4.0 x16; AMD introduced PCIe 4.0 support with the X570 platform at launch.	40 CPU lanes; PCIe 3.0
Chipsets
Chipsets	X570 at launch; check the motherboard's CPU support list and BIOS for other AM4 boards.	X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform.
Process
Process	TSMC 7nm FinFET CPU cores; 14nm I/O die (PCGamesN).	22 nm; Haswell-E. Package size 52.5 × 45.0 mm.
Cooler
Cooler	Retail boxed processor includes an RGB cooler (PCGamesN; inclusion also confirmed by TechRadar); AMD's current support specification does not name a cooler. Maximum operating temperature 95°C.	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required.