AMD Ryzen 9 9950X vs Intel Core i7-5960X

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 9 9950X compared with Core i7-5960X

	AMDRyzen 9 9950X	IntelCore i7-5960X
Overview
Released
Released	August 2024	August 2014
Cores and clocks
Cores
Cores	16 (better)	8
Threads
Threads	32 (better)	16
Base clock
Base clock	4.3 GHz	3 GHz
Boost clock
Boost clock	5.7 GHz (better)	3.5 GHz
L3 cache
L3 cache	64 MB (better)	20 MB
Cores
Cores	16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the package	Haswell-E; 8 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Turbo Boost 2.0 up to 3.50 GHz. August release month follows PCWorld’s 29 August report that Intel was shipping the models and TechSpot’s same-day expected retail availability. Intel’s 29 August notice instead says the three SKUs will be available next week; an exact maker first-sale day is unresolved.
Cache
Cache	L1 1280 KB, L2 16 MB, L3 64 MB	–
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required.
Platform
Socket
Socket	AM5	LGA2011-v3
Base power
Base power	170 W	140 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Up to 64 GB; four channels of DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	40 CPU lanes; PCIe 3.0
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform.
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	22 nm; Haswell-E. Package size 52.5 × 45.0 mm.
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required.