AMD Ryzen 9 7950X3D vs Intel Core i9-12900KS

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Ryzen 9 7950X3D compared with Core i9-12900KS

	AMDRyzen 9 7950X3D	IntelCore i9-12900KS
Overview
Released
Released	February 2023	April 2022
Cores and clocks
Cores
Cores	16	16 (8 performance, 8 efficiency)
Threads
Threads	32 (better)	24
Base clock
Base clock	4.2 GHz	3.4 GHz
Boost clock
Boost clock	5.7 GHz (better)	5.5 GHz
L3 cache
L3 cache	128 MB (better)	30 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 8 active cores each, one with 3D V-Cache (PC Gamer)	Alder Lake; 8 Performance-cores with Hyper-Threading and 8 Efficient-cores
Clocks
Clocks	Direct CPU overclocking is disabled; Precision Boost Overdrive and Curve Optimizer tuning remain supported (PC Gamer). AMD product launch date 28 February 2023 is corroborated as first sale by KitGuru	P-core base 3.4 GHz and turbo 5.2 GHz; E-core base 2.5 GHz and turbo 4 GHz; Turbo Boost Max 3.0 5.3 GHz; Thermal Velocity Boost up to 5.5 GHz
Cache
Cache	L1 1024 KB; L2 16 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (KitGuru)	14 MB L2 cache
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 770; 32 execution units; 300 MHz base and 1.55 GHz maximum dynamic clock
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	120 W	150 W
Maximum power
Maximum power	–	241 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 128 GB; two channels; DDR5-4800 or DDR4-3200; ECC support depends on the motherboard and configuration
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	20 CPU lanes; PCIe 5.0 and 4.0
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	Z690 with the latest BIOS; maker retail and OEM availability began on 5 April 2022, rather than the Q1 launch quarter listed in ARK
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7
Cooler
Cooler	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance	No cooler included, as explicitly reported by TechSpot and HotHardware; a separate cooler is required