AMD Ryzen 9 9950X vs AMD Ryzen Threadripper 7960X

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Ryzen 9 9950X compared with Ryzen Threadripper 7960X

	AMDRyzen 9 9950X	AMDRyzen Threadripper 7960X
Overview
Released
Released	August 2024	November 2023
Cores and clocks
Cores
Cores	16	24 (better)
Threads
Threads	32	48 (better)
Base clock
Base clock	4.3 GHz	4.2 GHz
Boost clock
Boost clock	5.7 GHz (better)	5.3 GHz
L3 cache
L3 cache	64 MB	128 MB (better)
Cores
Cores	16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the package	Storm Peak; Zen 4 architecture. Boxed product ID 100-100001352WOF; tray 100-000001352. AMD's support page gives 19 October 2023 as launch, its announcement date; the launch release confirms retail availability on 21 November.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer voltage offsets supported
Cache
Cache	L1 1280 KB, L2 16 MB, L3 64 MB	L1 1536 KB; L2 24 MB; the advertised 152 MB combined cache includes L2 and L3
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	A separate graphics card is required
Platform
Socket
Socket	AM5	sTR5
Base power
Base power	170 W	350 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	DDR5 RDIMM; four channels; up to 5200 MT/s. ECC enabled by default; AMD EXPO supported. AMD's TRX50 platform table specifies up to 1 TB memory.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	PCIe 5.0; 92 native/platform lanes, 88 usable. AMD's launch platform table distinguishes up to 48 PCIe 5.0 lanes. Four native USB 3.2 Gen 2 ports and two SATA ports; NVMe boot and RAID 0, 1, 10 and 5 supported.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	TRX50
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. Five package dies; CCD 71 mm², I/O die 388 mm².
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Cooler not included; maximum operating temperature 95°C