AMD Ryzen 9 9950X vs Intel Core i9-7900X

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Ryzen 9 9950X compared with Core i9-7900X

	AMDRyzen 9 9950X	IntelCore i9-7900X
Overview
Released
Released	August 2024	June 2017
Cores and clocks
Cores
Cores	16 (better)	10
Threads
Threads	32 (better)	20
Base clock
Base clock	4.3 GHz	3.3 GHz
Boost clock
Boost clock	5.7 GHz (better)	4.5 GHz
L3 cache
L3 cache	64 MB (better)	13.75 MB
Cores
Cores	16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the package	Skylake-X; 10 cores with Hyper-Threading. The unlocked multiplier is confirmed by Intel’s exact-model family product brief.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Turbo Boost Max 3.0 up to 4.50 GHz on the preferred core; ordinary Turbo Boost 2.0 up to 4.30 GHz. The main boost field uses Intel’s highest published frequency. Intel’s September press-kit record names 26 June 2017 availability for the first Core X processors; its August record confirms the four- to ten-core models were already on shelves. The exact model’s first-sale day was not established, so month precision is retained.
Cache
Cache	L1 1280 KB, L2 16 MB, L3 64 MB	13.75 MB Intel Smart Cache (L3).
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No processor graphics, explicitly stated in Intel’s exact-model comparison-chart row; a separate graphics solution is required.
Platform
Socket
Socket	AM5	LGA2066
Base power
Base power	170 W	140 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Up to 128 GB; four channels of DDR4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	44 CPU lanes; PCIe 3.0.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	Intel X299; LGA2066.
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	14 nm; Skylake-X.
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required. Published junction limit: 95°C.