AMD Ryzen 9 9950X vs Intel Core i9-9960X

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 9 9950X compared with Core i9-9960X

	AMDRyzen 9 9950X	IntelCore i9-9960X
Overview
Released
Released	August 2024	2018
Cores and clocks
Cores
Cores	16	16
Threads
Threads	32	32
Base clock
Base clock	4.3 GHz	3.1 GHz
Boost clock
Boost clock	5.7 GHz (better)	4.5 GHz
L3 cache
L3 cache	64 MB (better)	22 MB
Cores
Cores	16 Zen 5 cores with simultaneous multithreading; codename Granite Ridge AM5; 3 dies in the package	Skylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported	Turbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel planned November 2018 availability. ASCII’s contemporary report confirms Japanese retail sale on 21 December 2018, but earlier worldwide sale was not established; year precision is retained.
Cache
Cache	L1 1280 KB, L2 16 MB, L3 64 MB	22 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	AMD Radeon Graphics, 2 graphics cores at 2200 MHz; USB-C DisplayPort Alt Mode	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
Platform
Socket
Socket	AM5	LGA2066
Base power
Base power	170 W	165 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5, 2 channels, up to 256 GB (UDIMM); DDR5-5600 with 2 modules, DDR5-3600 with 4; ECC with motherboard support	Up to 128 GB; four channels of DDR 4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0; 28 lanes (24 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps), 1 × USB 2.0	44 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840, B850	Intel X 299; LGA 2066.
Process
Process	TSMC 4nm FinFET (CPU cores), TSMC 6nm FinFET (I/O die)	14 nm; Skylake-X refresh.
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 95°C	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 85°C.