AMD Ryzen Threadripper 7970X vs AMD Ryzen Threadripper PRO 5975WX

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Ryzen Threadripper 7970X compared with Ryzen Threadripper PRO 5975WX

	AMDRyzen Threadripper 7970X	AMDRyzen Threadripper PRO 5975WX
Overview
Released
Released	November 2023	March 2022
Cores and clocks
Cores
Cores	32	32
Threads
Threads	64	64
Base clock
Base clock	4 GHz	3.6 GHz
Boost clock
Boost clock	5.3 GHz (better)	4.5 GHz
L3 cache
L3 cache	128 MB	128 MB
Cores
Cores	Storm Peak; Zen 4 architecture. Boxed product ID 100-100001351WOF; tray 100-000001351. AMD's support page gives 19 October 2023 as launch, its announcement date; the launch release confirms retail availability on 21 November.	Chagall PRO; Zen 3. Boxed product ID 100-100000445WOF; tray ID 100-000000445. AMD confirmed all five 5000 WX models available in Lenovo ThinkStation P620 systems on 8 March 2022; this is the OEM release, before later standalone retail availability.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer voltage offsets supported	Precision Boost 2; maximum boost up to 4.5 GHz. Unlocked for overclocking; OEM system restrictions can differ.
Cache
Cache	L1 2048 KB; L2 32 MB; the advertised 160 MB combined cache includes L2 and L3	L1 2048 KB; L2 16 MB; L3 128 MB
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	A separate graphics card is required	A separate graphics card is required
Platform
Socket
Socket	sTR5	sWRX8
Base power
Base power	350 W	280 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	–
Memory support
Memory support	DDR5 RDIMM; four channels; up to 5200 MT/s. ECC enabled by default; AMD EXPO supported. AMD's TRX50 platform table specifies up to 1 TB memory.	DDR4; eight channels; up to 3200 MT/s. AMD’s launch specification supports up to 2 TB ECC UDIMM, RDIMM or LRDIMM memory; motherboard and system limits can be lower.
PCIe
PCIe	PCIe 5.0; 92 native/platform lanes, 88 usable. AMD's launch platform table distinguishes up to 48 PCIe 5.0 lanes. Four native USB 3.2 Gen 2 ports and two SATA ports; NVMe boot and RAID 0, 1, 10 and 5 supported.	PCIe 4.0; AMD’s exact-model launch table lists 128 lanes
Chipsets
Chipsets	TRX50	–
Process
Process	CPU cores: TSMC 5 nm FinFET; I/O die: TSMC 6 nm FinFET. Five package dies; CCD 71 mm², I/O die 388 mm².	CPU cores: TSMC 7 nm FinFET
Cooler
Cooler	Cooler not included; maximum operating temperature 95°C	AMD’s current specification does not state whether a cooler is included. Maximum operating temperature 95°C.