Intel Core 2 Quad Q6600 vs Intel Core i7-860

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Core 2 Quad Q6600 compared with Core i7-860

	IntelCore 2 Quad Q6600	IntelCore i7-860
Overview
Released
Released	January 2007	September 2009
Cores and clocks
Cores
Cores	4	4
Threads
Threads	4	8 (better)
Base clock
Base clock	2.4 GHz	2.8 GHz
Boost clock
Boost clock	–	3.46 GHz
L3 cache
L3 cache	–	8 MB
Cores
Cores	Kentsfield; four cores and four threads, without Hyper-Threading. Original B3 stepping is the numerical baseline; later G0 retains the model name and core/cache figures. Locked multiplier confirmed by bit-tech’s exact-model review.	Four cores and eight threads with Hyper-Threading. Alphr’s exact review explicitly lists the clock multiplier as locked.
Clocks
Clocks	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel’s 8 January 2007 release explicitly states immediate availability in PCs and the reseller channel. No unpublished boost frequency is supplied.	2.80 GHz base; up to 3.46 GHz with one core active, 3.33 GHz with two and 2.93 GHz with four, per Intel’s exact embedded brief. Intel’s 8 September 2009 launch states availability that day and names the 860 in its table.
Cache
Cache	Two 4 MB L2 caches, one per dual-core die; total 8 MB. Intel’s datasheet also lists four 32 KB L1 data caches. No L3 figure is supplied.	8 MB shared L3 cache.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics, confirmed by the exact BX80562Q6600 retail listing; motherboard graphics are a separate component.	Intel’s exact-model comparison chart lists no processor graphics.
Platform
Socket
Socket	LGA775	LGA1156
Base power
Base power	105 W	95 W
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; memory types and capacity depend on the motherboard.	Two channels of DDR3-1066/1333 in Intel’s exact embedded product brief.
PCIe
PCIe	–	16 PCIe 2.0 lanes, configurable as one ×16 or two ×8 links; DMI connects the chipset, according to Intel’s launch and embedded brief.
Process
Process	65 nm; Kentsfield; LGA775.	45 nm; Lynnfield. Intel’s launch names the P55 platform.
Cooler
Cooler	Boxed BX80562Q6600 listing confirms heatsink and fan. Intel’s datasheet and PCN107463 distinguish original B3 105 W from later G0 95 W; the projected July 2007 conversion date is not treated as an independently verified sale day.	–