Intel Core i3-13100F vs Intel Core i5-4670K

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Core i3-13100F compared with Core i5-4670K

	IntelCore i3-13100F	IntelCore i5-4670K
Overview
Released
Released	January 2023	June 2013
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	4
Threads
Threads	8 (better)	4
Base clock
Base clock	3.4 GHz	3.4 GHz
Boost clock
Boost clock	4.5 GHz (better)	3.8 GHz
L3 cache
L3 cache	12 MB (better)	6 MB
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Haswell; four cores without Hyper-Threading; unlocked multiplier confirmed by TechRadar and Expert Reviews
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	–
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel HD Graphics 4600; 350 MHz base and 1.2 GHz maximum dynamic clock
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1150
Base power
Base power	58 W	84 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 32 GB; two channels; DDR3 or DDR3L-1333/1600 at 1.5 V; no ECC support
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	16 CPU lanes; PCIe 3.0
Chipsets
Chipsets	–	LGA1150 platform; release month uses contemporary June retail availability, as Intel ARK lists only Q2 2013. Intel's 4 June family release and earlier retailer coverage do not establish a single exact first-sale day.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	22 nm
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	–