Intel Core i3-13100F vs Intel Core i7-3770K

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Core i3-13100F compared with Core i7-3770K

	IntelCore i3-13100F	IntelCore i7-3770K
Overview
Released
Released	January 2023	April 2012
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	4
Threads
Threads	8	8
Base clock
Base clock	3.4 GHz	3.5 GHz
Boost clock
Boost clock	4.5 GHz (better)	3.9 GHz
L3 cache
L3 cache	12 MB (better)	8 MB
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0. TechRadar confirms the unlocked multiplier.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Maximum turbo is a single-core frequency. Intel announced systems available on 23 April and boxed processors later that month; the 29 April retail sale date comes from Ars Technica's update quoting Newegg.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel HD Graphics 4000; 650 MHz base, up to 1.15 GHz; three displays; Quick Sync Video.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1155
Base power
Base power	58 W	77 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 32 GB; two channels; DDR3-1333/1600; 25.6 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	PCIe 3.0; configurations up to 1×16, 2×8 or 1×8+2×4.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	22 nm; Ivy Bridge; 37.5 × 37.5 mm package; 67.4°C maximum case temperature, not junction temperature.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	LGA1155 motherboard compatibility depends on chipset and firmware; Expert Reviews advises confirming older 6-series board support with the motherboard maker. Intel's current specifications give no separate maximum turbo-power figure.