Intel Core i3-13100F vs Intel Core i7-3960X Extreme Edition
Better figure, where one is clearly better
| IntelCore i3-13100F | IntelCore i7-3960X Extreme Edition | |
|---|---|---|
| Overview | ||
| Released | January 2023 | November 2011 |
| Cores and clocks | ||
| Cores | 4 (4 performance, 0 efficiency) | 6 (better) |
| Threads | 8 | 12 (better) |
| Base clock | 3.4 GHz | 3.3 GHz |
| Boost clock | 4.5 GHz (better) | 3.9 GHz |
| L3 cache | 12 MB | 15 MB (better) |
| Cores | Four P-cores and no E-cores; Hyper-Threading supported. | Six cores and twelve threads with Hyper-Threading; fully unlocked multiplier confirmed by Intel’s exact product brief. Intel states that VT-d requires C2 stepping. |
| Clocks | CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W. | 3.30 GHz base and up to 3.90 GHz Turbo Boost 2.0. Intel gives Q4 2011; EE Times’ contemporary 14 November report quotes Intel confirming the exact model is available now. Newegg’s earlier listing date alone does not establish sale. |
| Cache | 12 MB Intel Smart Cache (L3); 5 MB total L2. | 15 MB shared L3 cache. |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics; a separate graphics card is required (Intel support). | Intel’s exact-model Extreme Edition chart lists no processor graphics. |
| AI engine | Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported. | – |
| Platform | ||
| Socket | LGA1700 | LGA2011 |
| Base power | 58 W | 130 W |
| Maximum power | 110 W | – |
| Unlocked | No | Yes |
| Cooler in the box | Yes | No |
| Memory support | Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB. | Up to 64 GB across four DDR3-1066/1333/1600 channels; maximum 51.2 GB/s bandwidth, without ECC. |
| PCIe | PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8. | 40 PCIe 2.0 lanes in Intel’s current exact specification page. |
| Process | Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature. | 32 nm; Sandy Bridge-E. Package 52.5 × 45.0 mm; Intel’s 66.8°C limit is TCASE, not junction temperature. |
| Cooler | Boxed retail processor includes Intel Laminar RM1 (Intel support). | Intel explicitly says the boxed product has no fan or heatsink. Requires separate LGA2011-compatible cooling; the original product brief names X79. |
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