Intel Core i3-13100F vs Intel Core i7-4960X

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Core i3-13100F compared with Core i7-4960X

	IntelCore i3-13100F	IntelCore i7-4960X
Overview
Released
Released	January 2023	September 2013
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	6 (better)
Threads
Threads	8	12 (better)
Base clock
Base clock	3.4 GHz	3.6 GHz
Boost clock
Boost clock	4.5 GHz (better)	4 GHz
L3 cache
L3 cache	12 MB	15 MB (better)
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Ivy Bridge-E; 6 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Turbo Boost 2.0 up to 4.00 GHz. September availability follows contemporary Ivy Bridge-E store availability coverage and Expert Reviews’ 10 September exact-model review with a retail supplier and price. Intel gives Q3 2013; an exact maker first-sale day was not established.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA2011
Base power
Base power	58 W	130 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 64 GB; four channels of DDR3-1333/1600/1866; maximum bandwidth 59.7 GB/s; no ECC.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	40 CPU lanes; PCIe 3.0
Chipsets
Chipsets	–	X79 and LGA2011, confirmed by the exact-model reviews.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	22 nm; Ivy Bridge-E. Package size 52.5 × 45.0 mm.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required.