Intel Core i3-13100F vs Intel Core i7-5820K
Better figure, where one is clearly better
| IntelCore i3-13100F | IntelCore i7-5820K | |
|---|---|---|
| Overview | ||
| Released | January 2023 | August 2014 |
| Cores and clocks | ||
| Cores | 4 (4 performance, 0 efficiency) | 6 (better) |
| Threads | 8 | 12 (better) |
| Base clock | 3.4 GHz | 3.3 GHz |
| Boost clock | 4.5 GHz (better) | 3.6 GHz |
| L3 cache | 12 MB | 15 MB (better) |
| Cores | Four P-cores and no E-cores; Hyper-Threading supported. | Haswell-E; six cores with Hyper-Threading; unlocked multiplier and lack of integrated graphics confirmed by exact-model reviews |
| Clocks | CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W. | – |
| Cache | 12 MB Intel Smart Cache (L3); 5 MB total L2. | – |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics; a separate graphics card is required (Intel support). | – |
| AI engine | Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported. | – |
| Platform | ||
| Socket | LGA1700 | LGA2011-v3 |
| Base power | 58 W | 140 W |
| Maximum power | 110 W | – |
| Unlocked | No | Yes |
| Cooler in the box | Yes | No |
| Memory support | Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB. | Up to 64 GB; four channels; DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC support |
| PCIe | PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8. | 28 CPU lanes; PCIe 3.0 |
| Chipsets | – | X99 and LGA2011-v3, as distinguished by Intel's Core i7 comparison chart and exact-model reviews. August release month follows Intel's 29 August family availability notice and contemporary exact-model stock coverage; an exact maker-SKU first-sale day was not established. |
| Process | Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature. | 22 nm; package size 52.5 × 45 mm |
| Cooler | Boxed retail processor includes Intel Laminar RM1 (Intel support). | Intel explicitly excludes a fan and heatsink from the boxed product; a separate cooler is required |
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