Intel Core i3-13100F vs Intel Core i7-7700K
Better figure, where one is clearly better
| IntelCore i3-13100F | IntelCore i7-7700K | |
|---|---|---|
| Overview | ||
| Released | January 2023 | January 2017 |
| Cores and clocks | ||
| Cores | 4 (4 performance, 0 efficiency) | 4 |
| Threads | 8 | 8 |
| Base clock | 3.4 GHz | 4.2 GHz |
| Boost clock | 4.5 GHz | 4.5 GHz |
| L3 cache | 12 MB (better) | 8 MB |
| Cores | Four P-cores and no E-cores; Hyper-Threading supported. | Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported. |
| Clocks | CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W. | Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure. |
| Cache | 12 MB Intel Smart Cache (L3); 5 MB total L2. | – |
| Graphics and AI | ||
| Built-in graphics | No | Yes |
| Graphics | No integrated graphics; a separate graphics card is required (Intel support). | Intel HD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. Hardware HEVC 10-bit encode and decode, and VP9 10-bit decode, according to Intel's desktop product brief. |
| AI engine | Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported. | – |
| Platform | ||
| Socket | LGA1700 | LGA1151 |
| Base power | 58 W | 91 W |
| Maximum power | 110 W | – |
| Unlocked | No | Yes |
| Cooler in the box | Yes | No |
| Memory support | Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB. | Up to 64 GB; two channels; DDR4-2133/2400 or DDR3L-1333/1600 at 1.35 V; ECC not supported. |
| PCIe | PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8. | PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. |
| Process | Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature. | 14 nm; Kaby Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel describes the manufacturing process as 14 nm+ in its product brief. |
| Cooler | Boxed retail processor includes Intel Laminar RM1 (Intel support). | Boxed processor includes no fan or heatsink. Intel announced the desktop family on 3 January 2017; TechSpot's contemporaneous launch review confirms availability that day. |
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