Intel Core i3-13100F vs Intel Core i7-860

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Core i3-13100F compared with Core i7-860

	IntelCore i3-13100F	IntelCore i7-860
Overview
Released
Released	January 2023	September 2009
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	4
Threads
Threads	8	8
Base clock
Base clock	3.4 GHz	2.8 GHz
Boost clock
Boost clock	4.5 GHz (better)	3.46 GHz
L3 cache
L3 cache	12 MB (better)	8 MB
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Four cores and eight threads with Hyper-Threading. Alphr’s exact review explicitly lists the clock multiplier as locked.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	2.80 GHz base; up to 3.46 GHz with one core active, 3.33 GHz with two and 2.93 GHz with four, per Intel’s exact embedded brief. Intel’s 8 September 2009 launch states availability that day and names the 860 in its table.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	8 MB shared L3 cache.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel’s exact-model comparison chart lists no processor graphics.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1156
Base power
Base power	58 W	95 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Two channels of DDR3-1066/1333 in Intel’s exact embedded product brief.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	16 PCIe 2.0 lanes, configurable as one ×16 or two ×8 links; DMI connects the chipset, according to Intel’s launch and embedded brief.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	45 nm; Lynnfield. Intel’s launch names the P55 platform.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	–