Intel Core i3-13100F vs Intel Core i7-960
Better figure, where one is clearly better
| IntelCore i3-13100F | IntelCore i7-960 | |
|---|---|---|
| Overview | ||
| Released | January 2023 | October 2009 |
| Cores and clocks | ||
| Cores | 4 (4 performance, 0 efficiency) | 4 |
| Threads | 8 | 8 |
| Base clock | 3.4 GHz | 3.2 GHz |
| Boost clock | 4.5 GHz (better) | 3.46 GHz |
| L3 cache | 12 MB (better) | 8 MB |
| Cores | Four P-cores and no E-cores; Hyper-Threading supported. | Four cores and eight threads with Hyper-Threading. Hardware-Magazin's exact-model introduction explicitly describes a fixed multiplier; base-clock overclocking remains possible. |
| Clocks | CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W. | 3.2 GHz base and up to 3.46 GHz Turbo Boost. Intel lists Q4 2009. The October on-sale month uses Tom's Hardware Italia's 20 October 2009 availability report and TweakTown's 21 October report of a listed OEM chip. Japan's boxed retail availability followed in February 2010. |
| Cache | 12 MB Intel Smart Cache (L3); 5 MB total L2. | 8 MB shared L3 cache. |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics; a separate graphics card is required (Intel support). | Intel's exact-model comparison chart lists no processor graphics. |
| AI engine | Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported. | – |
| Platform | ||
| Socket | LGA1700 | LGA1366 |
| Base power | 58 W | 130 W |
| Maximum power | 110 W | – |
| Unlocked | No | No |
| Cooler in the box | Yes | Yes |
| Memory support | Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB. | Three channels of DDR3-800 or DDR3-1066; up to 24 GB in Intel's 45 nm Core i7-900 datasheet. Faster memory used by reviews is not the maker's rated limit. |
| PCIe | PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8. | – |
| Process | Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature. | 45 nm; Bloomfield. |
| Cooler | Boxed retail processor includes Intel Laminar RM1 (Intel support). | Intel's boxed-processor datasheet includes an unattached fan and heatsink. An LGA1366 motherboard is required. |
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