Intel Core i3-13100F vs Intel Core i9-13900K

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Core i3-13100F compared with Core i9-13900K

	IntelCore i3-13100F	IntelCore i9-13900K
Overview
Released
Released	January 2023	October 2022
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	24 (8 performance, 16 efficiency) (better)
Threads
Threads	8	32 (better)
Base clock
Base clock	3.4 GHz	3 GHz
Boost clock
Boost clock	4.5 GHz	5.8 GHz (better)
L3 cache
L3 cache	12 MB	36 MB (better)
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	8 P-cores and 16 E-cores; 32 threads. Intel Thread Director supported.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	P-cores: 3.0 GHz base, up to 5.4 GHz Turbo Boost 2.0, 5.7 GHz Turbo Boost Max 3.0 and 5.8 GHz Thermal Velocity Boost. E-cores: 2.2 GHz base, up to 4.3 GHz turbo.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	36 MB Intel Smart Cache (L3); 32 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel UHD Graphics 770; 32 execution units; 300 MHz base, up to 1.65 GHz; Quick Sync Video; up to four displays.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1700
Base power
Base power	58 W	125 W
Maximum power
Maximum power	110 W	253 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 192 GB on the current Intel specification page; two channels; DDR5-5600 or DDR4-3200; 89.6 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	–	Intel 600- and 700-series motherboards; BIOS support required. Intel recommends the latest motherboard BIOS and Intel Default Settings to mitigate 13th/14th-generation Vmin Shift instability risk; 0x12F supplements earlier mitigations (Intel, May 2025).
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	Intel 7; Raptor Lake; 45×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	Boxed K processor does not include a fan heatsink (Intel support).