Intel Core i5-14400F vs Intel Core i5-750

Every spec side by side, from each maker's published figures.

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Core i5-14400F compared with Core i5-750
IntelCore i5-14400FIntelCore i5-750
Overview
ReleasedJanuary 2024September 2009
Cores and clocks
Cores10 (6 performance, 4 efficiency) (better)4
Threads16 (better)4
Base clock2.5 GHz2.66 GHz
Boost clock4.7 GHz (better)3.2 GHz
L3 cache20 MB (better)8 MB
Cores6 Performance-cores and 4 Efficient-cores, with Hyper-Threading; codename Raptor LakeFour cores and four threads; Hyper-Threading is absent. TechRadar's exact Core i5-750 overclocking guide confirms the CPU multiplier is locked; base-clock overclocking remains possible.
ClocksP-core base 2.5 GHz, max turbo 4.7 GHz; E-core base 1.8 GHz, max turbo 3.5 GHzUp to 3.20 GHz Turbo Boost. Intel's embedded product brief specifies 3.20 GHz with one or two active cores and 2.80 GHz with four; actual behaviour depends on workload, cooling and platform limits.
Cache20 MB Intel Smart Cache (L3); 9.5 MB L2–
Graphics and AI
Built-in graphicsNoNo
GraphicsNone; a graphics card is requiredNo processor graphics; Intel's desktop comparison chart lists graphics as not applicable. A separate graphics solution is required.
Platform
SocketLGA1700LGA1156
Base power65 W95 W
Maximum power148 W–
UnlockedNoNo
Memory supportUp to DDR5 4800 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GBTwo channels of DDR3-1066/1333. Optional maximum memory capacity and bandwidth are omitted because the retired exact-model specification page could not be read.
PCIePCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x816 processor PCIe 2.0 lanes, configurable as one ×16 or two ×8 graphics links. A separate DMI link connects the processor to the chipset.
ProcessIntel 745 nm; Lynnfield, based on the Nehalem architecture.
Coolermax operating temperature 100 °C; thermal specification PCG 2020CLGA1156 platform, distinct from LGA775 and LGA1366. Intel's 8 September 2009 notice names the 750 and says the new processors and P55 chipset are available that day. Cooler inclusion and package temperature are omitted where maker evidence is unavailable.

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