Intel Core i5-8600K vs Intel Core i7-7700K

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Core i5-8600K compared with Core i7-7700K

	IntelCore i5-8600K	IntelCore i7-7700K
Overview
Released
Released	October 2017	January 2017
Cores and clocks
Cores
Cores	6 (better)	4
Threads
Threads	6	8 (better)
Base clock
Base clock	3.6 GHz	4.2 GHz
Boost clock
Boost clock	4.3 GHz	4.5 GHz (better)
L3 cache
L3 cache	9 MB (better)	8 MB
Cores
Cores	Six cores without Hyper-Threading; Intel Turbo Boost 2.0 supported.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. CPU, graphics and memory overclocking require a supported chipset. Intel publishes TDP without a separate maximum turbo-power figure.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel UHD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video.	Intel HD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. Hardware HEVC 10-bit encode and decode, and VP9 10-bit decode, according to Intel's desktop product brief.
Platform
Socket
Socket	LGA1151	LGA1151
Base power
Base power	95 W	91 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 128 GB in the current Intel specifications; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported. The original eighth-generation product brief listed a 64 GB limit.	Up to 64 GB; two channels; DDR4-2133/2400 or DDR3L-1333/1600 at 1.35 V; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature.	14 nm; Kaby Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel describes the manufacturing process as 14 nm+ in its product brief.
Cooler
Cooler	Boxed processor includes no fan or heatsink. Requires a supported Intel 300-series motherboard despite sharing the LGA1151 socket name with earlier processors.	Boxed processor includes no fan or heatsink. Intel announced the desktop family on 3 January 2017; TechSpot's contemporaneous launch review confirms availability that day.