Intel Core i5-9400F vs Intel Core i5-9600K

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Core i5-9400F compared with Core i5-9600K

	IntelCore i5-9400F	IntelCore i5-9600K
Overview
Released
Released	January 2019	October 2018
Cores and clocks
Cores
Cores	6	6
Threads
Threads	6	6
Base clock
Base clock	2.9 GHz	3.7 GHz
Boost clock
Boost clock	4.1 GHz	4.6 GHz (better)
L3 cache
L3 cache	9 MB	9 MB
Cores
Cores	Six cores without Hyper-Threading; Intel Turbo Boost 2.0 supported. Intel's F suffix denotes a processor requiring separate graphics; its multiplier is locked.	Six cores without Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel publishes TDP without a separate maximum turbo-power figure.	Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel publishes TDP without a separate maximum turbo-power figure. TechSpot's 2023 revisit uses newer games; Notebookcheck's preselected and delidded sample results are separate from its ordinary retail sample.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated GPU; a separate graphics card is required, including for motherboard display outputs.	Intel UHD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz.
Platform
Socket
Socket	LGA1151	LGA1151
Base power
Base power	65 W	95 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.	Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. ComputerBase identifies a paste thermal interface on its launch sample; this should not be assumed for every later stepping.	14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models.
Cooler
Cooler	Boxed cooler included and tested by TechSpot. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support. Intel's January release notice gives a late-January through first-quarter rollout for the new models; IT Home reports the exact 9400F on sale in China on 28 January, supporting month precision rather than a confirmed worldwide first-sale day.	Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support.