Intel Core i5-9600K vs Intel Core i7-6700K

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Core i5-9600K compared with Core i7-6700K

	IntelCore i5-9600K	IntelCore i7-6700K
Overview
Released
Released	October 2018	August 2015
Cores and clocks
Cores
Cores	6 (better)	4
Threads
Threads	6	8 (better)
Base clock
Base clock	3.7 GHz	4 GHz
Boost clock
Boost clock	4.6 GHz (better)	4.2 GHz
L3 cache
L3 cache	9 MB (better)	8 MB
Cores
Cores	Six cores without Hyper-Threading; Intel Turbo Boost 2.0 supported.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel publishes TDP without a separate maximum turbo-power figure. TechSpot's 2023 revisit uses newer games; Notebookcheck's preselected and delidded sample results are separate from its ordinary retail sample.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel UHD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz.	Intel HD Graphics 530; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. DisplayPort and eDP up to 4096×2304 at 60 Hz; HDMI up to 4096×2304 at 24 Hz.
Platform
Socket
Socket	LGA1151	LGA1151
Base power
Base power	95 W	91 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.	Up to 64 GB; two channels; DDR4-1866/2133 or DDR3L-1333/1600 at 1.35 V; 34.1 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. PC Gamer describes the Z170 platform's faster DMI 3.0 chipset link and expanded storage connectivity.
Process
Process	14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models.	14 nm; Skylake; 37.5 × 37.5 mm package; Intel lists a 64°C Tcase limit, which is a case-temperature specification rather than a junction-temperature limit.
Cooler
Cooler	Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support.	Boxed processor includes no fan or heatsink. Requires a compatible Intel 100-series motherboard; the launch notice names the Z170 chipset for unlocked processors.